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Microelectronic Packaging In T...
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Microelectronic Packaging In The 21st Century
Main Author:
Fraunhofer Verlag
Other Authors:
Rolf Aschenbrenner
,
Martin Schneider-Ramelow
Published:
London:
IZM,
2015.
Subjects:
Microelectronics
Holdings
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Item Description:
Includes Bibliographical references and Index
Physical Description:
axiz ,411 Pages: ill.(black and white); 24cm.
ISBN:
9783839608265
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