|
|
|
|
LEADER |
00774cam a2200193 7i4500 |
001 |
0000014126 |
005 |
20150325090000.0 |
003 |
iicp-my |
005 |
20120504155600.0 |
008 |
120503 000 0 eng d |
039 |
|
9 |
|a 201205041556
|b diyana
|y 201205031159
|z diyana
|
090 |
0 |
0 |
|a March 2012 (16)
|
100 |
1 |
|
|a Ho Kah Chun
|
245 |
0 |
0 |
|a Pattern recognition technique for solder joint quality inspection / by Ho Kah Chun..
|
260 |
|
|
|a INTI International College Penang Stage 3 B. Eng. Project.
|
300 |
|
|
|a Binding books - Student Project..
|
500 |
|
|
|a Bachelor of Engineering (Hons) in Electrical & Electronics Engineering 3+0 in collaboration with University of Bradford, UK
|
500 |
|
|
|a Project Supervisor: Ms Shalyn Lim Sheue Hui
|
999 |
|
|
|a 6000000259
|b Book
|c Red Spot
|