Electronic packaging of high speed circuitry

Main Author: Konsowski, Stephen G.
Other Authors: Helland, Arden R.
Language:English
Published: New York: McGraw-Hill, c1999..
Series:Electronic packaging and interconnection series
Subjects:
LEADER 00905cam a2200253 7i4500
001 0000011087
005 20150325090000.0
003 iicp-my
005 20040309110300.0
008 040309s1997 nyua b 001 0 eng
020 |a 0071164553  
035 |a 1651260 
039 9 |y 200403091103  |z Yusnizam 
090 0 0 |a 621.381   |b KON 
100 1 |a Konsowski, Stephen G.  
245 0 0 |a Electronic packaging of high speed circuitry   |c by Stephen G. Konsowski, Arden R. Helland ; drawings by Darnetta Anderson and Robert L. Thing, Jr.. 
260 |a New York:   |b McGraw-Hill,   |c c1999.. 
300 |a p.:   |b ill.;   |c cm.. 
490 0 |a Electronic packaging and interconnection series 
500 |a Includes bibliographical references and index. 
650 0 |a Electronic packaging.  
650 0 |a Microwave devices --   |x Design and construction.  
700 1 |a Helland, Arden R.  
999 |a 1000018808  |b Book  |c White Spot