Skip to content
Toggle navigation
SEAL
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Accession No
Control No
Find
Advanced
Area array packaging handbook...
Preview
Cite this
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Export to MARC
Export to MARCXML
Area array packaging handbook : manufacturing and assembly
Main Author:
Gilleo, Ken
Published:
New York:
McGraw Hill,
2002..
Subjects:
Ball grid array technology.
Microelectronic packaging.
Holdings
Description
Preview
Similar Items
Staff View
Similar Items
Microelectronic Packaging In The 21st Century Honorary Volume On The Occasion Of Klaus-Dieter Lang's 60th Birthday.
by: Fraunhofer Verlag
Published: (2015)
Electronic packaging of high speed circuitry by Stephen G. Konsowski, Arden R. Helland ; drawings by Darnetta Anderson and Robert L. Thing, Jr..
by: Konsowski, Stephen G.
Published: (1999)
PIC microcontroller : an introduction to software and hardware interfacing / by Han Way Huang.
by: Huang, Han-Way
Published: (2005)
Manufacturing engineering and technology by Serope Kalpakijan & Steven R. Schmid.
by: Kalpakijan, Serope
Published: (2023)
Marketing and information technology : the strategy, application and implementation of IT in Marketing John O'Connor, Eamonn Galvin..
by: O'Connor, John.
Published: (1997)
×
Loading...